Valued Subscriber, Global 5G improvements coming for consumers

Global 5G improvements coming for consumers

View web version 15 February 2024 — Issue 7 | Vol 9     Source Products  |  Webinar Library  |  Standards Global 5G improvements coming for consumers Strong growth in 5G subscriptions is forecast to continue in 2024 along with improvements globally for speeds and network operations, however, universal speeds won't be a thing and will vary widely depending on the region. Read more → Critical Link, LLC Greater performance, less power in your next embedded design Do more with Critical Link's latest solution featuring Agilex 5E up to 656KLE FPGA, Cortex-A55 + Cortex-A76, on-board power and memory, with 2.5 X greater performance and 50% less power.   View more Future Electronics Low-energy, long range: Download this tech paper to integrate Panasonic Industry PAN1781 seamlessly The Panasonic Industry PAN1781 Series Bluetooth Low Energy Module is the newest solution for IoT applications requiring long-range capabilities. Download this tech paper to tackle the complexity of implementation using this module.   Learn more HyperloopTT begins work on first commercial hyperloop While the validity of a functioning commercial hyperloop remains a topic of much debate, companies are continuing to develop the technology as a potential fifth mode of transportation. Read more → TSMC to build second chip fab in Japan Semiconductor manufacturing is rapidly expanding beyond the traditional aggregation of Asia with the U.S., Europe and Japan all investing heavily in domestic semiconductor fabs. Read more →

PEI-Genesis Harsh environment connector distributor As a global distributor, PEI-Genesis offers harsh-environment interconnect and cable solutions. With over 25 manufacturing partners, we provide off-the-shelf or value-added custom solutions. Check out our latest line card today!   View more Infineon expands SiC wafer deal with Wolfspeed The multi-year capacity reservation agreement will give Infineon a secured supply of SiC semiconductor products on Wolfspeed's 150 mm process technology. Read more → Intel opens first mass production 3D chip packaging site The opening of Fab 9 is part of Intel's previously announced $3.5 billion investment to improve manufacturing and operations for packaging, including its Foveros 3D packaging technology. Read more →

Connect with us: Feedback on this issue? Tell us what you think Join our team of Expert Contributors   GlobalSpec publishes more than 60 free industry newsletters - browse our portfolio. Want to reach industry executives with your message? Download our media kit or contact us directly at sales@globalspec.com. About this email: You are receiving this message as part of your complimentary newsletter subscription to Electronics360. If you no longer wish to receive this newsletter, you can modify your preferences or unsubscribe. Copyright © 2024 GlobalSpec LLC, Unless otherwise noted. All rights reserved. GlobalSpec LLC | 257 Fuller Road Suite NFE 1100 | Albany, NY 12203-3621